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Performance LadderFree referenceUpdated 2026-08-0265 entries · 2005–2026

Mobile SoC Performance Ladder (2005–2026)

Snapdragon vs Apple A/M vs Dimensity vs Exynos — 21 years of mobile chips tier-ranked.

How to use this ladder

This tier list groups Mobile SoC Ladder into seven performance tiers from S (Supreme / flagship) to D (Legacy / entry-level). Each tier is ordered by release year, newest first. A newer chip one tier down often outperforms an older chip one tier up. Use this as a reference for relative positioning, not as a benchmark — actual FPS varies by game, resolution and driver. Tiers are updated quarterly to reflect new releases and re-benchmarks.

S · Supreme
A+ · High-end
A · High
B+ · Mid-high
B · Mid
C · Budget
D · Legacy
Tier S10 entries
  • Apple A19 ProApple2026

    3nm N3P, 6-core CPU, 6-core GPU, 2nd-gen HW ray tracing, iPhone 17 Pro

  • Qualcomm Snapdragon 8 Elite Gen 5Qualcomm2026

    TSMC 3nm N3P, Oryon CPU 4.4GHz, Adreno 840, top Android flagship

  • MediaTek Dimensity 9500MediaTek2026

    TSMC 3nm N3P, 1×Cortex-X930 + 3×X930 + 4×A730, Immortalis-D12, flagship

  • Qualcomm Snapdragon 8 Elite Gen 2Qualcomm2025

    4nm TSMC, Oryon CPU, Adreno 750, top Android flagship

  • Apple A18 ProApple2024

    3nm, 6-core CPU, 6-core GPU, Neural Engine, iPhone 16 Pro

  • MediaTek Dimensity 9400MediaTek2024

    3nm, 1×Cortex-X5 + 3×X5 + 4×A720, Immortalis GPU

  • Apple A17 ProApple2023

    3nm, 6-core CPU, 6-core GPU, first hardware ray tracing

  • Qualcomm Snapdragon 8 Gen 3Qualcomm2023

    4nm TSMC, Kryo Prime + 4×Gold + 3×Silver, Adreno 750

  • Apple A16 BionicApple2022

    4nm, 6-core CPU, 5-core GPU, iPhone 14 Pro

  • Qualcomm Snapdragon 8 Gen 2Qualcomm2022

    4nm TSMC, Kryo 8 Gen 2, Adreno 740, first in-house Oryon

Tier A+9 entries
  • Google Tensor G5Google2026

    TSMC 3nm (first TSMC Tensor), 1×Prime + 3×Gold + 4×Silver, Mali GPU, Pixel 11

  • Samsung Exynos 2500Samsung2026

    3nm, 1×Cortex-X930 + 3×X730 + 4×A520, Xclipse 950 GPU, Galaxy S26

  • Apple A18Apple2024

    3nm, 6-core CPU, 5-core GPU, iPhone 16

  • Google Tensor G4Google2024

    4nm, 1×Prime + 3×Gold + 4×Silver, Mali GPU, Pixel flagship

  • Samsung Exynos 2400Samsung2024

    4nm, 1×Cortex-X4 + 4×X4 + 3×A720, Xclipse GPU

  • MediaTek Dimensity 9300MediaTek2023

    4nm TSMC, 1×Cortex-X4 + 3×X4 + 4×A720, Immortalis GPU

  • Qualcomm Snapdragon 7+ Gen 3Qualcomm2023

    4nm TSMC, Kryo 7+, Adreno 720, top mid-range

  • Apple A15 BionicApple2021

    5nm, 6-core CPU, 5-core GPU, iPhone 13/14

  • Qualcomm Snapdragon 8 Gen 1Qualcomm2021

    4nm Samsung, Kryo 8 Gen 1, Adreno 730

Tier A9 entries
  • Qualcomm Snapdragon 8s EliteQualcomm2026

    TSMC 4nm, scaled Oryon CPU, Adreno 825, sub-flagship tier

  • MediaTek Dimensity 9400EMediaTek2026

    4nm, 1×Cortex-X5 + 3×A720 + 4×A520, scaled Dimensity 9400

  • Google Tensor G3Google2023

    4nm, 1×Prime + 4×Gold + 4×Silver, Mali GPU

  • MediaTek Dimensity 9000+MediaTek2022

    4nm TSMC, 1×Cortex-X3 + 3×X3 + 4×A710, Immortalis GPU

  • Qualcomm Snapdragon 7+ Gen 2Qualcomm2022

    4nm TSMC, Kryo 7+, Adreno 720, top mid-range

  • Samsung Exynos 2200Samsung2022

    4nm, 1×Cortex-X2 + 3×X2 + 4×A710, Xclipse GPU

  • MediaTek Dimensity 9000MediaTek2021

    4nm TSMC, 1×Cortex-X2 + 3×X2 + 4×A710, Immortalis GPU

  • Apple A14 BionicApple2020

    5nm, 6-core CPU, 4-core GPU, iPhone 12

  • Qualcomm Snapdragon 865Qualcomm2020

    7nm TSMC, Kryo 585, Adreno 650, 5G integrated

Tier B+7 entries
  • Google Tensor G2Google2022

    4nm, 1×Prime + 4×Gold + 4×Silver, Mali GPU

  • MediaTek Dimensity 8200MediaTek2022

    4nm, 1×Cortex-A78 + 3×A78 + 4×A55, Mali GPU

  • Qualcomm Snapdragon 6 Gen 1Qualcomm2022

    4nm TSMC, Kryo 670, Adreno 710, mid-range

  • Samsung Exynos 1280Samsung2022

    5nm, 2×Cortex-A78 + 6×A55, Mali GPU

  • MediaTek Dimensity 1200MediaTek2020

    7nm, 1×Cortex-A78 + 3×A78 + 4×A55, Mali GPU

  • Apple A13 BionicApple2019

    7nm, 6-core CPU, 4-core GPU, iPhone 11

  • Qualcomm Snapdragon 855Qualcomm2019

    7nm TSMC, Kryo 485, Adreno 640, first Tri-cluster

Tier B7 entries
  • MediaTek Helio G95MediaTek2020

    12nm, 2×Cortex-A76 + 6×A55, Mali GPU

  • Qualcomm Snapdragon 765GQualcomm2020

    7nm, Kryo 475, Adreno 620, mid-range 5G

  • MediaTek Dimensity 1000MediaTek2019

    7nm, 4×Cortex-A76 + 4×A55, Mali GPU

  • Samsung Exynos 9825Samsung2019

    7nm, 2×Cortex-M4 + 2×M4 + 4×A55, Mali GPU

  • Apple A12 BionicApple2018

    7nm, 6-core CPU, 4-core GPU, iPhone XS

  • Qualcomm Snapdragon 845Qualcomm2018

    10nm, Kryo 385, Adreno 630, Galaxy S9

  • Apple A11 BionicApple2017

    10nm, 6-core CPU, 3-core GPU, iPhone 8/X

Tier C8 entries
  • Samsung Exynos 1080Samsung2021

    5nm, 1×Cortex-A78 + 3×A78 + 4×A55, Mali GPU

  • Qualcomm Snapdragon 732GQualcomm2020

    8nm, Kryo 470, Adreno 618, budget mid-range

  • MediaTek Helio G88MediaTek2020

    12nm, 2×Cortex-A75 + 6×A55, Mali GPU

  • MediaTek Helio G35MediaTek2020

    12nm, 8×Cortex-A53, Mali GPU, entry budget

  • Qualcomm Snapdragon 665Qualcomm2019

    11nm, Kryo 260, Adreno 610, budget

  • Qualcomm Snapdragon 835Qualcomm2017

    10nm, Kryo 280, Adreno 540, Galaxy S8

  • MediaTek Helio X30MediaTek2017

    10nm, 10×Cortex-A73, Mali GPU, first 10-core mobile

  • Apple A10 FusionApple2016

    16nm, 2×Twister + 2×Hurricane, iPhone 7

Tier D15 entries
  • Qualcomm Snapdragon 480Qualcomm2021

    8nm, Kryo 460, Adreno 610, entry 5G

  • MediaTek Helio A25MediaTek2020

    12nm, 8×Cortex-A53, Mali GPU, low-end

  • Qualcomm Snapdragon 820Qualcomm2016

    14nm, Kryo 200, Adreno 530, Galaxy S7

  • Apple A9Apple2015

    14nm, 2×Twister, iPhone 6s

  • MediaTek Helio P10MediaTek2015

    28nm, 8×Cortex-A53, Mali GPU, first mass Helio

  • Qualcomm Snapdragon 410Qualcomm2014

    28nm, 8×Cortex-A53, Adreno 306, entry

  • Apple A7Apple2013

    28nm, Cyclone, iPhone 5s, first 64-bit mobile

  • Qualcomm Snapdragon 600Qualcomm2013

    28nm, Krait 300, Adreno 320, classic mid-range

  • MediaTek MT6589MediaTek2013

    28nm, 4×Cortex-A7, PowerVR GPU, first quad-core mobile

  • Apple A6Apple2012

    32nm, Swift, iPhone 5

  • Qualcomm Snapdragon S4 ProQualcomm2012

    28nm, Krait 200, Adreno 320, first dual-core Krait

  • MediaTek MT6575MediaTek2010

    65nm, single-core ARM11, basic smartphone SoC

  • Apple A4Apple2010

    45nm, ARM Cortex-A8, iPhone 4, first Apple designed chip

  • Qualcomm Snapdragon S2Qualcomm2008

    65nm, ARM9, basic smartphone SoC

  • Qualcomm Snapdragon S1Qualcomm2005

    65nm, ARM926EJ-S, first Snapdragon, low-end feature phones

Methodology & update cadence

Tiers are assigned based on real-world benchmark consensus across multiple publications (AnandTech, TechPowerUp, Tom's Hardware, NotebookCheck). Gaming performance at 1080P/1440P/4K is weighted for consumer chips; multi-core and productivity benchmarks are weighted for workstation parts. Tiers are relative, not absolute — a chip's position reflects its standing at the time of its launch, not its performance today. New entries are added quarterly (March, June, September, December) as new chips launch and comprehensive benchmarks become available.

Last updated: 2026-08-02 · Next update: quarterly cadence

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